Located in Eugene, Oregon, Hynix Semiconductor Manufacturing America Inc.
(HSMA) operates a state-of-the-art semiconductor facility designed to be a world leader in memory chip production.
The fabrication facility (FAB) has a production capacity of 33,000 wafers per month. Once the wafers have completed processing, they are sent to Hynix Semiconductor Industries (HSI) in Korea where they are sliced into individual chips, tested, packaged, and shipped to customers all over the world.
The facility operates with approximately 835 full-time employees with an additional 150 contracted on-site service providers.
The labor pool in the Eugene/Springfield area is rich in diversity and very well educated, having both the University of Oregon and Oregon State University within 45 minutes of the FAB.
The livability of surrounding communities, in combination with the vast availability of recreational activities, makes employee retention an easy task.
Memory chips made in Eugene can be found in a broad spectrum of products used in the home and in the workplace.
Hynix Semiconductor Manufacturing America Inc, Eugene OR, is registered by Underwriters Laboratories Inc to
